Connector assembly with integrated pitch translation
AssigneeIntel Corporation
InventorsGaurav Chawla, Rajasekaran Raja Swaminathan, Donald T. Tran
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AssigneeIntel Corporation
InventorsGaurav Chawla, Rajasekaran Raja Swaminathan, Donald T. Tran
Estimating the term…
This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.
A connector assembly, comprising:
A connector for electrically and mechanically coupling to a first plurality of conductive members being secured with respect to one another and forming a first row, comprising:
A chip package, comprising:
Dependencies are inferred from the claim text.