Vertical socket contact with flat force response
AssigneeIntel Corporation
InventorsJoshua D. Heppner, Sriram Srinivasan
Life of this patent
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Abstract
An apparatus includes a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
Claims23
An apparatus to contact an integrated circuit, the apparatus comprising:
- a plurality of contact elements to provide electrical continuity between an integrated circuit and an electronic subassembly, wherein a contact element includes a spring element and a separate lead element, wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
A test fixture comprising:
- a printed circuit board (PCB);
- and
- an integrated circuit (IC) socket in electrical communication with the PCB, wherein the IC socket includes:
- a plurality of contact elements to provide electrical continuity between an integrated circuit and the PCB, wherein a contact element includes a spring element and a separate lead element, and wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
An electronic system comprising:
- a PCB;
- an IC including a processor circuit;
- and
- an IC socket mounted on the PCB and arranged to provide electrical continuity between the IC and the PCB,
- wherein the IC socket includes a plurality of contact elements to provide electrical continuity between the IC and the PCB, wherein a contact element includes a spring element and a separate lead element, and wherein the spring element is arranged to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element.
A method of making a device to contact an integrated circuit, the method comprising:
- forming a contact element that includes a separate spring element and a separate lead element, wherein the spring element is formed to be substantially vertically slidable over at least a portion of the lead element in response to a force applied to the contact element;
- and
- forming a plurality of the contact elements and arranging the contact elements in an IC socket body to provide electrical continuity between an integrated circuit and an electronic subassembly.
Dependencies are inferred from the claim text.