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US 2014/0273520 A1Published application
Enhanced productivity for an etch system through polymer management
AssigneeApplied Materials, Inc.
InventorsRobert CHEBI, Alfredo GRANADOS, Zhao H. CENG, Jianqi WANG, Rajan BALESAN
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Abstract
Embodiments described herein generally relate to an apparatus and methods for reducing the deposition of polymers in a semiconductor processing chamber. A heater jacket and heat sources are provided and may be configured to maintain a uniform temperature profile of the processing chamber. A method of maintaining a uniform temperature profile of a dielectric ceiling of the processing chamber is also provided.
Claims20
An apparatus for processing a substrate, comprising:
- a dielectric ceiling having a roughened surface;
- a conductive body disposed within an insulator;
- a substrate support;
- a pump port disposed within a heater jacket, the heater jacket having a plurality of heating elements disposed therein configured to maintain a uniform temperature profile of the pump port;
- and
- a plurality of heat sources configured to maintain a uniform temperature profile of the dielectric ceiling.
3 more elements
A method of controlling polymer deposition, comprising:
- forming a plasma in a processing chamber by providing power to one or more RF coils;
- providing power to a plurality of heat sources when substantially no power is provided to the RF coils;
- and
- configuring the heat sources to maintain a constant temperature of a dielectric ceiling by alternating power to the RF coils and the heat sources.
1 more element
A heater jacket, comprising:
- a jacket body disposed around a pump port;
- a first heating element disposed adjacent a first region of the pump port;
- a second heating element disposed adjacent a second region of the pump port;
- and
- a third heating element disposed adjacent a third region of the pump port.
2 more elements
Dependencies are inferred from the claim text.