Method and Apparatus for Localized and Controlled Removal of Material from a Substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHui-Min Huang, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A method and a system that include providing a localized dispensing apparatus. A substrate having a material disposed on its top surface is oriented above the localized dispensing apparatus. A chemical is then dispensed from the localized dispensing apparatus onto the top surface of the oriented substrate. The chemical removes the material. The path for the material removal may be determined and the localized dispensing apparatus programmed to provide chemical according to the path.
Claims20
A method, comprising:
- providing a localized dispensing apparatus;
- orienting a substrate having a photosensitive material disposed on a top surface of the substrate above the localized dispensing apparatus;
- and
- dispensing a solvent from the localized dispensing apparatus onto the top surface of the oriented substrate, wherein the solvent removes the photosensitive material.
A method, comprising:
- receiving data describing a pattern of material formed on a substrate;
- defining a path for removing the pattern of material using a programmable, localized dispensing apparatus;
- and
- using the localized dispensing apparatus to dispense solvent onto the substrate according to the defined path.
A system, comprising:
- a support chuck operable to hold a semiconductor wafer;
- a localized dispensing apparatus disposed under the support chuck, wherein the localized dispensing apparatus includes:
- a tank operable to hold a solvent;
- a conduit extending substantially vertically upward from the tank;
- and
- a pump for providing the solvent from the tank to through the conduit;
- and
- wherein the support chuck holds the semiconductor wafer in an inverted position such that a surface of the semiconductor wafer having incident solvent faces downward.
Dependencies are inferred from the claim text.