Methods for processing a substrate using a selectively grounded and movable process kit ring

A computer readable medium having instructions stored thereon that, when executed, cause a method of processing a substrate to be performed in a process chamber, the method comprising:

• placing a substrate atop a substrate support disposed beneath a processing volume of a process chamber having a grounded shield surrounding the process volume and a conductive cover ring selectably supportable by the grounded shield;
• positioning the substrate support in a first position such that the substrate support is not in contact with the conductive cover ring and such that a first conductive member electrically coupled to the cover ring contacts the grounded shield to electrically couple the cover ring to the grounded shield;
• and
• performing a plasma enhanced etch process on the substrate.