Manufacturing method of semiconductor device and dry etching apparatus for the same
AssigneeDenso Corporation
InventorsYoshinori TSUCHIYA, Shinichi HOSHI, Masaki MATSUI
Life of this patent
Estimating the term…
Loading patent…
AssigneeDenso Corporation
InventorsYoshinori TSUCHIYA, Shinichi HOSHI, Masaki MATSUI
Estimating the term…
A manufacturing method of a semiconductor device including arranging a compound semiconductor above a stage of a chamber, supplying an etching gas into the chamber, and generating a plasma in the chamber is provided. The compound semiconductor includes a group-III element nitride as a main component. A surface of the compound semiconductor is processed by a dry etching. Light is irradiated into the chamber during the generating of the plasma. A dry etching apparatus including a chamber including a stage, on which a compound semiconductor is mounted, and a light source irradiating light into the chamber is provided. The chamber is supplied with an etching gas. A plasma is generated in the chamber. A surface of the compound semiconductor is an object of a dry etching.
A manufacturing method of a semiconductor device comprising:
A dry etching apparatus comprising:
Dependencies are inferred from the claim text.