Composition for forming titanium-containing resist underlayer film and patterning process

A composition for forming a titanium-containing resist underlayer film comprising:

• as a component (A), one or more kinds of compounds selected from titanium compounds represented by the following general formulae (A-1) and (A-2) and a titanium-containing compound obtained by hydrolysis and/or condensation of the titanium compounds,
• Ti(OR1A)4 (A-1)
• Ti(OR1A)4-na(OR2AO)na (A-2)
• wherein, R1A represents a monovalent organic group having 1 to 20 carbon atoms containing 0 or 1 hydroxyl group;
• R2A represents a divalent organic group having 2 to 20 carbon atoms containing 0 or 1 hydroxyl group;
• and “na” satisfies 0<na≦4;
• as a component (B), one or more kinds of compounds selected from titanium compounds represented by the following general formulae (B-1) and (B-2) and a titanium-containing compound obtained by hydrolysis and/or condensation of the titanium compounds,
• Ti(OR1B)4 (B-1)
• Ti(OR1B)4-nb(OR2BO)nb (B-2)
• wherein, R1B represents a monovalent organic group having 1 to 20 carbon atoms containing 0 or 1 hydroxyl group;
• R2B represents a divalent organic group having 2 to 20 carbon atoms containing 0 or 1 hydroxyl group;
• R1A and R1B are different and/or R2A and R2B are different;
• and “nb” satisfies 0<nb≦4;
• and as a component (D), solvent.