Semiconductor device channels
AssigneeInternational Business Machines Corporation
InventorsDavid H. Allen, Douglas M. Dewanz, David P. Paulsen, John E. Sheets, II, Kelly L. Williams
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AssigneeInternational Business Machines Corporation
InventorsDavid H. Allen, Douglas M. Dewanz, David P. Paulsen, John E. Sheets, II, Kelly L. Williams
Estimating the term…
A semiconductor device and a method of manufacture are provided. The semiconductor device includes one or more layers having channels adapted to carry signals or deliver power. The semiconductor device may include a signal channel and a power channel. The power channel may include power channel cross-sectional portions. A first conductor in the power channel may have a first cross-sectional area. A second conductor in the signal channel may have a second cross-sectional area. The second cross-sectional area may be smaller than the first cross-sectional area. The method of manufacture includes establishing a signal conductor layer including a signal channel and a power channel, introducing a first conductor in the power channel having a first cross-sectional area, and introducing a second conductor in the signal channel having a second cross-sectional area where the second cross-sectional area is smaller than the first cross-sectional area.
A method of manufacturing a semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.