Laser resist removal for integrated circuit (ic) packaging
AssigneeIntel Corporation
InventorMotohiko Sasagawa
Life of this patent
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Abstract
Embodiments of the present disclosure are directed to laser removal of resist material from integrated circuit (IC) packaging components, as well as package assemblies and systems incorporating such material and removal methods. A resist layer may be applied to one or more components of a package assembly. The resist layer may be subsequently removed by applying laser radiation and a flow of fluid to the resist layer. The laser radiation may cause cracking, delamination, and/or polymer chain scission, and the flow of fluid may enhance mechanical separation of the resist material from the package assembly components.
Claims25
A method comprising:
- exposing a portion of a solder resist layer disposed on a die to a laser light, wherein the laser light is configured to induce crack formation in the portion of the solder resist layer;
- and
- applying a flow of fluid to the exposed portion of the solder resist layer to separate the exposed portion of the solder resist layer from the die.
A method comprising:
- forming a resist layer on a die, wherein the die comprises a first surface with a plurality of electrical routing features;
- forming interconnect structures on the electrical routing features, the interconnect structures disposed through the resist layer;
- exposing a portion of the resist layer to a laser light, wherein the laser light is configured to cause crack formation at an interface between the resist layer and the die;
- and
- applying a flow of fluid to the exposed portion of the resist layer to separate the exposed portion of the resist layer from the die at the interface.
Dependencies are inferred from the claim text.