Method of making package with interposer frame
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJiun Yi WU
Life of this patent
Estimating the term…
Abstract
A method of forming a package on package structure includes bonding a semiconductor die and an interposer frame to a substrate, and the interposer frame surrounds the semiconductor die. The semiconductor die is disposed in an opening of the interposer frame, and the interposer frame has a plurality of TSHs. The plurality of TSHs is aligned with a plurality of bumps on the substrate. The method also includes positioning a packaged die over the semiconductor die and the interposer frame. The packaged die has a plurality of bumps aligned with the plurality of TSHs of the interposer. The method further includes performing a reflow process to allow solder of the plurality of bumps of the substrate and the solder of the plurality of bumps of the packaged die to fill the plurality of TSHs.
Claims20
A method of forming a package on package structure with an interposer frame, the method comprising:
- bonding a semiconductor die and an interposer frame to a substrate, wherein the interposer frame surrounds the semiconductor die, wherein the semiconductor die is disposed in an opening of the interposer frame, and wherein the interposer frame has a plurality of TSHs, wherein the plurality of TSHs is aligned with a plurality of bumps on the substrate;
- positioning a packaged die over the semiconductor die and the interposer frame, wherein the packaged die has a plurality of bumps aligned with the plurality of TSHs of the interposer;
- and
- performing a reflow process to allow solder of the plurality of bumps of the substrate and the solder of the plurality of bumps of the packaged die to fill the plurality of TSHs.
A method of forming a package on package structure, the method comprising:
- positioning a semiconductor die in an opening in an interposer frame;
- bonding the semiconductor die and the interposer frame to a substrate, wherein the interposer frame has a plurality of through substrate holes (TSHs), and the plurality of TSHs is aligned with a plurality of bumps on the substrate,
- wherein at least one TSH of the plurality of TSHs is line with a conductive layer,
- wherein a thickness of the conductive layer is in a range from about 2 microns (μm) to about 40 μm.
A method of forming a package on package structure, the method comprising:
- positioning a semiconductor die in an opening in an interposer frame, wherein a width of the opening in the interposer frame ranges from about 2 millimeters (mm) to about 500 mm;
- bonding the semiconductor die and the interposer frame to a substrate, wherein the interposer frame has a plurality of through substrate holes (TSHs), and the plurality of TSHs is aligned with a plurality of bumps on the substrate,
- wherein at least one TSH of the plurality of TSHs is line with a conductive layer.
Dependencies are inferred from the claim text.