Semiconductor device
AssigneeFreescale Semiconductor, Inc.
InventorsLeo M. Higgins, III, Sheila F. Chopin
Life of this patent
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Abstract
A method includes forming a packaged integrated circuit that includes forming a lead frame by separating an outer portion of the metal structure into a plurality of leads by stamping. The plurality of leads have sides with a first concavity. The lead frame is further formed by performing an etch on the sides of the plurality of leads to achieve a second concavity on the sides of leads. The second concavity is greater than the first concavity. A semiconductor die is attached to a center portion of the metal structure. Electrical attachments are made between the die and the leads.
Claims20
A method of forming a packaged integrated circuit, comprising:
- forming a lead frame by:
- separating an outer portion of the metal structure into a plurality of leads by stamping, wherein the plurality of leads have sides with a first concavity;
- and
- performing an etch on the sides of the plurality of leads to achieve a second concavity on the sides of the plurality of leads, wherein the second concavity is greater than the first concavity;
- attaching a semiconductor die to a center portion of the die;
- making electrical attachments between the die and the leads;
- and
- covering the die.
A method of using a metal structure having a top surface and a bottom surface in forming a packaged die, comprising:
- forming a plurality of leads on an outer portion of the metal structure by stamping the metal structure, wherein the stamping results in sides of the plurality of leads having a concave shape;
- increasing a depth of the concave shape by etching;
- attaching a die to an inner portion of the metal structure;
- attaching wire bonds between the plurality of leads and the die;
- and
- covering the die.
A method of forming a packaged die using a metal structure, comprising:
- stamping a plurality of leads from an outer portion of the metal structure, wherein sides of the plurality of leads having a concave structure to a first depth;
- etching the plurality of leads to increase the concave structure to a second depth greater than the first depth;
- attaching a die to an inner portion of the metal structure;
- attaching wire bonds between the die and the plurality of leads;
- placing a mold over the die and the wire bonds;
- filling the mold with molding compound;
- and
- removing the mold.
Dependencies are inferred from the claim text.