Package-on-package electronic devices including sealing layers and related methods of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsChoongbin YIM, Hae-Jung YU, Taesung PARK
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Abstract
A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.
Claims6
A method of forming a package-on-package (POP) electronic device, the method comprising:
- providing a first packaging substrate having a first semiconductor integrated circuit (IC) device electrically and mechanically coupled thereto;
- providing a second packaging substrate having a second semiconductor integrated circuit (IC) device electrically and mechanically coupled thereto;
- providing a solder interconnection between the first and second packaging substrates with the first semiconductor IC device between the first and second packaging substrates and spaced apart from the solder interconnection;
- and
- providing a sealing layer on the solder interconnection.
A method of forming a package-on-package (POP) electronic device, the method comprising:
- providing a mold layer on a first packaging substrate wherein the mold layer includes a via therethrough;
- providing a solder interconnection between the first packaging substrate and a second packaging substrate wherein the solder interconnection extends through the via to provide electrical and mechanical coupling between the first and second packaging substrates;
- and
- providing a sealing layer between the mold layer and the second packaging substrate and/or in the via between the mold layer and the plurality of solder interconnections.
Dependencies are inferred from the claim text.