Methods for bonding a hermetic module to an electrode array

A method for attaching a lead wire to a module frame, the module frame including at least one module pad, the method comprising the steps of:

• drilling a hole in the hermetic module frame adjacent the at least one module pad;
• feeding an electrode wire through the hole;
• securing the wire in place within the hole;
• connecting the at least one module pad to the hole and thereby the wire;
• and
• overmolding the alumina module frame.

A method for bonding a hermetic module to an electrode array and attaching a lead wire thereto, the electrode array including at least one module pad, the method comprising the steps of:

• providing the electrode array having a substrate with a top surface and a bottom surface, wherein the at least one module pad is in the top surface of the substrate;
• attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having at least one bond-pad, wherein the bond-pad is adjacent to the bottom surface of the electrode array and aligns with the at least one module pad;
• drilling a first hole through the at least one module pad to the at least one bond-pad;
• filling the first hole with biocompatible conductive ink;
• forming a rivet on the biocompatible conductive ink over the at least one module pad;
• drilling a second hole in the electrode array and hermetic module adjacent the at least one module pad;
• feeding an electrode wire through the second hole;
• securing the wire in place within the second hole;
• connecting the at least one module pad to the hole and thereby the wire;
• and
• overmolding the electrode array and hermetic module.