Systems and methods for fabricating semiconductor device structures using different metrology tools
AssigneeGlobalfoundries Inc.
InventorsAlok Vaid, Carsten Hartig
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Abstract
Methods and systems are provided for fabricating and measuring physical features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves obtaining a first measurement of a first attribute of the semiconductor device structure from a first metrology tool, obtaining process information pertaining to fabrication of one or more features of the semiconductor device structure by a first processing tool, and determining an adjusted measurement for the first attribute based at least in part on the first measurement in a manner that is influenced by the process information.
Claims20
A system for fabricating a semiconductor device structure, the system comprising:
- a first processing tool configured to fabricate a feature of the semiconductor device structure;
- a first metrology tool configured to obtain a first measurement of an attribute of the semiconductor device structure;
- and
- a computing device coupled to the first metrology tool and configured to obtain process information pertaining to the fabrication of the feature of the semiconductor device structure by the first processing tool and determine a second measurement of the attribute based at least in part on the first measurement in a manner that is influenced by the process information.
A method of fabricating a semiconductor device structure, the method comprising:
- obtaining a first measurement of a first attribute of the semiconductor device structure from a first metrology tool;
- obtaining process information pertaining to fabrication of a feature of the semiconductor device structure by a first processing tool;
- and
- determining a second measurement for the first attribute based at least in part on the first measurement in a manner that is influenced by the process information.
A method of fabricating a semiconductor device structure, the method comprising:
- obtaining a first measurement of a feature of the semiconductor device structure from a first metrology tool;
- obtaining a second measurement of an attribute of the semiconductor device structure from a second metrology tool;
- obtaining process information pertaining to fabrication of the feature by a first processing tool;
- and
- determining a process-enhanced hybrid measurement for the feature based at least in part on the first measurement in a manner that is influenced by the process information and the second measurement.
Dependencies are inferred from the claim text.