Method for forming biochips and biochips with non-organic landings for improved thermal budget

A method of manufacturing a biochip, comprising:

• forming a plurality of first landings on a first substrate;
• depositing a passivating layer over and between the plurality of first landings on the first substrate;
• depositing and planarizing an oxide layer over the passivating layer on the first substrate;
• fusion bonding the oxide layer on the first substrate to a transparent substrate;
• grinding the transparent substrate;
• bonding the transparent substrate to a carrier wafer;
• etching a backside of the first substrate in a pattern to expose some of the plurality of first landings;
• depositing a protective layer over the exposed plurality of first landings and the first substrate;
• forming through-holes in the transparent substrate;
• removing the protective layer;
• fusion bonding the first substrate and a second substrate having a plurality of second landings thereon;
• and
• removing the carrier wafer.

A method of manufacturing a biochip, comprising:

• providing a transparent substrate;
• bonding a carrier wafer to the transparent substrate;
• forming a patterned passivating layer and first landings on the transparent substrate;
• forming a patterned adhesion layer on the transparent substrate;
• providing a second substrate having a plurality of second landings and a plurality of through-holes;
• bonding the transparent substrate to the second substrate via the patterned adhesion layer;
• removing the carrier wafer;
• and
• flowing bio-materials through microfluidic channels having the patterned adhesion layer as sidewalls, wherein the bio-materials adhere on the first and second landings.

A method of manufacturing a biochip, comprising:

• providing a transparent substrate and a second substrate;
• bonding a carrier wafer to the transparent substrate;
• forming a patterned passivating layer and first landings on the transparent substrate;
• forming a plurality of second landings on the second substrate;
• forming a patterned adhesion layer on the transparent substrate or the second substrate;
• forming a plurality of through-holes in the transparent substrate;
• bonding the transparent substrate to the second substrate via the patterned adhesion layer;
• and
• removing the carrier wafer.