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US 2014/0272684 A1Published application
Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor
AssigneeApplied Materials, Inc.
InventorsRalf Hofmann, Cara Beasley, Majeed Foad
Life of this patent
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Abstract
A processing system includes: a vacuum chamber; a plurality of processing systems attached around the vacuum chamber; and a wafer handling system in the vacuum chamber for moving the wafer among the plurality of processing systems without exiting from a vacuum. A physical vapor deposition system for manufacturing an extreme ultraviolet blank comprising: a target comprising molybdenum, molybdenum alloy, or a combination thereof.
Claims22
A processing system comprising:
- a vacuum chamber;
- a plurality of processing systems attached around the vacuum chamber;
- and
- a wafer handling system in the vacuum chamber for moving the wafer among the plurality of processing systems without exiting from a vacuum.
1 more element
A physical vapor deposition system for manufacturing an extreme ultraviolet blank comprising:
- a target comprising molybdenum, molybdenum alloy, or a combination thereof.
A method of forming a EUV mask blank, comprising:
- forming a planarization layer by chemical vapor deposition over a substrate;
- and
- forming a multi-layer stack over the planarization layer by physical vapor deposition wherein forming the planarization layer and forming the multi-layer stack are performed in a production system without removing the substrate from vacuum.
Dependencies are inferred from the claim text.