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US 2014/0272597 A1Published application
Protected electrode structures and methods
AssigneeSion Power Corporation
InventorsYuriy V. Mikhaylik, Michael G. Laramie, John Joseph Christopher Kopera
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Abstract
An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer.
Claims28
A method, comprising:
- providing a first carrier substrate;
- depositing a first release layer on the first carrier substrate, wherein a mean peak to valley roughness of a surface of the first release layer opposite the first carrier substrate is between about 0.1 μm and about 1 μm, and wherein the first release layer has a thickness of greater than or equal to about 2 μm;
- depositing a first protective layer on the surface of the first release layer;
- and
- depositing a first electroactive material layer on the first protective layer,
- wherein an adhesive strength between the first release layer and the first protective layer is greater than an adhesive strength between the first release layer and the first carrier substrate.
3 more elements
A method, comprising:
- providing a first carrier substrate;
- depositing a first release layer on the first carrier substrate, wherein the first release layer comprises a polymer gel;
- depositing a first protective layer on the surface of the first release layer, wherein a thickness of the first release layer is greater than the mean peak to valley roughness of the substrate;
- and
- depositing a first electroactive material layer on the first protective layer.
2 more elements
An electrode structure comprising:
- a first carrier substrate;
- a first release layer disposed on the first carrier substrate;
- a first protective layer disposed on the first release layer, wherein a mean peak to valley roughness of an interface between the first release layer and the first protective layer is between about 0.1 μm and about 1 μm;
- and
- a first electroactive material layer disposed on the first protective layer.
2 more elements
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Dependencies are inferred from the claim text.