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US 2014/0272472 A1Published application
Method and apparatus for chemical-mechanical polishing
AssigneeSeagate Technology LLC
InventorsEric Walter Singleton, Shaun Eric McKinlay, Stacey Christine Wakeham
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Abstract
In accordance with certain embodiments, a method can be utilized that includes depositing a backfill material layer over a reader stack; depositing a chemical-mechanical-polishing stop layer above the layer of backfill material; and depositing a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
Claims20
A method comprising:
- depositing a backfill material layer over a reader stack;
- depositing a chemical-mechanical-polishing stop layer above the layer of backfill material;
- depositing a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
An apparatus comprising:
- a reader stack;
- a backfill layer disposed next to the reader stack;
- a chemical-mechanical polishing stop layer disposed above the backfill layer;
- a sacrificial layer disposed on top of the chemical-mechanical-polishing stop layer.
1 more element
Dependencies are inferred from the claim text.