Adhesive film having good machinability for protecting the surface of a semiconductor wafer

Abstract

The present invention relates to an adhesive film for protecting a wafer including an adhesive layer formed on one surface of a substrate film. The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer, wherein the surface film has a tensile strength of 2-10 kg/mm2 and an elongation until breakage of 50-200%, and the gel content of the adhesive layer is greater than or equal to 80%. The adhesive film for protecting the wafer maintains cutting ability and machinability, while preventing the generation of bending and wafer breaking phenomena due to the decrease of the wafer thickness. In addition, the adhesive film may not melt at high temperatures, and the yield while grinding the wafer may be increased.

Dependencies are inferred from the claim text.