Multi-function epoxy casting resin system

A printed circuit board, the printed circuit board comprising:

• at least one electronic component, the electronic component being at least partially covered by an epoxy resin and/or cured epoxy comprising:
• 15-26 wt. % of at least one epoxy resin base reactive constituent;
• 2-5 wt. % of diluent;
• 0.5-1.5 wt. % of at least one color pigment;
• 40-60 wt. % of at least one thermally conductive filler;
• 2.5-4.0 wt. % of at least one reactive constituent;
• 8.5-16 wt. % of at least one flame retardant;
• 5-10 wt. % of at least one reactive agent;
• and
• 1-3 wt. % catalyst.

A method of producing a casting epoxy comprising:

• producing component A by combining:
• about 15%-26% bisphenol F epoxy resin;
• about 2%-5% butyl glycidyl ether;
• about 0.5%-1.5% epoxy carbon black dispersion;
• about 40%-60% aluminum oxide;
• about 2.5%-4% phosphorous salt;
• about 7%-12% alumina trihydrate;
• and
• about 1.5%-4% ammonium poly phosphate;
• producing component B by combining:
• about 5%-10% polyglycol diamine;
• and
• about 1%-3% of polyamine blend;
• combining component A with component B to form an uncured resin;
• and
• curing the uncured resin to form a cured resin.