Method for fabricating negative photoresist etched pits and trenches as controlled optical path and a device fabricated thereby
AssigneeTyco Electronics Corporation
InventorsJonathan Edward LEE, Mike Tryson
Life of this patent
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Abstract
This invention overcomes the challenge of finding and applying a suitable underfill material in an optical engine by filling the gap between a substrate-mounted optical device (such as a VCSEL/PIN) and a fiber transmitting light to/receiving light from the optical device. The air gap is filled with SU-8 Negative Photoresist (or any material with the same functional and optical characteristics) via spin coating during the wafer processing portion of the engine assembly. The SU-8 material can be used to fill only the area around a 45 degree mirror (i.e., the pit) or can be deployed both in the pit and part of the fiber trench.
Claims14
A process for forming an a optical device, comprising:
- forming a pit in a substrate, said pit having an angled edge;
- depositing a reflective layer on the angled edge;
- and
- forming a divergence-limiting material within the pit, thereby covering and protecting the reflective layer and minimizing beam divergence of light traveling therethrough.
An optical device, comprising:
- a substrate
- a pit formed in said substrate, said trench having an angled edge;
- a reflective layer deposited on the angled edge;
- and
- a divergence-limiting fill formed within the pit, thereby covering and protecting the reflective layer and minimizing beam divergence of light traveling therethrough.
Dependencies are inferred from the claim text.