US 2014/0272174 A1Published application

Pattern formation method and pattern formation device

AssigneeKabushiki Kaisha Toshiba

InventorYohko FURUTONO

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Abstract

According to one embodiment, a pattern formation method is disclosed. The method includes preparing a substrate having an underlying pattern and a mold having a concave/convex pattern. The method cures the resin in an uncured region and separate the mold from the resin. The curing the resin includes first and second curing processes. When the uncured region is provided in a plurality, the first process includes performing position alignment of the mold with reference to the substrate, determining a positional displacement amount of the concave/convex pattern with reference to the underlying pattern, and curing the resin in the uncured region having the smallest positional displacement amount. The performing, the determining and the curing are repeated until the uncured regions are reduced to one. When the uncured region is one, the second process includes performing position alignment of the mold with reference to the substrate, and curing the resin.

Claims16

Dependent claims

A pattern formation method comprising:

preparing a substrate having an underlying pattern and applying a resin to the substrate;
preparing a mold having a concave/convex pattern, interposing the mold on the substrate, and causing the concave/convex pattern to contact the resin;
curing the resin in an uncured region where the resin is uncured, the uncured region being one of a plurality of regions into which the resin is divided;
and
separating the mold from the resin,
the curing the resin in the uncured region including:
a first curing process;
and
a second curing process,
when the uncured region is provided in a plurality,
the first curing process including:
performing position alignment of the mold with reference to the substrate;
determining a positional displacement amount of the concave/convex pattern with reference to the underlying pattern for each of the plurality of uncured regions;
and
curing the resin in the uncured region having a smallest positional displacement amount in the plurality of uncured regions,
the performing, the determining and the curing being repeated until the uncured regions are reduced to one;
when the uncured region is one,
the second curing process including:
performing position alignment of the mold with reference to the substrate;
and
curing the resin in the uncured region.

18 more elements

A pattern formation device comprising:

a mold holder holding a mold having a concave/convex pattern;
a substrate holder holding a substrate;
an alignment unit configured to perform position alignment between the substrate and the mold;
an applying unit configured to apply a resin on the substrate;
a drive unit configured to drive the mold holder and the substrate holder;
a light emitting unit configured to emit a light exposed to the resin;
and
a control unit configured to control the light emitting unit so that the resin is divided into a plurality of regions and an uncured region of the plurality of regions is exposed to the light, the resin being uncured in the uncured region, when the resin is exposed to the light in a state of the concave/convex pattern contacting the resin, and configured to control the drive unit so separate the mold from the resin after the resin in the plurality of regions being cured,
the control unit performing a first process,
when the uncured region is provided in a plurality,
the first process including:
controlling the alignment unit so as to perform position alignment of the mold with reference to the substrate;
operating a positional displacement amount of the concave/convex pattern by reference to the underlying pattern for each of the plurality of uncured regions;
and
controlling the control unit so as to cure the resin by exposing the resin in the uncured region having a smallest positional displacement amount out of the plurality of the uncured regions to the light,
until the uncured regions are reduced to one,
the control unit performing a second process,
when the uncured region is one,
the second process including:
controlling the alignment unit so as to perform position alignment of the mold with reference to the substrate;
and
controlling the light emitting unit so as to curing the resin by exposing the resin in the uncured region to the light.

19 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/966,596Filed 14 Aug 2013
Priority: JP 2013-05363415 Mar 2013
Published: 18 Sep 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

B05C 9/12
For applying liquid or other fluent material and performing an auxiliary operation: the auxiliary operation being performed after the application
G03F 7/0002
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g.…
H10F 77/707
Surface textures, e.g. pyramid structures: of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate
Y02E 10/50
Energy generation through renewable energy sources: photovoltaic [PV] energy