Lead-free solder composition
AssigneeAntaya Technologies Corporation
InventorsJennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
Life of this patent
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Abstract
A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.
Claims40
A method of forming a solder composition comprising mixing indium, nickel, copper, silver, antimony, and tin together to form an alloy that includes:
- about 4% to about 25% by weight tin;
- about 0.1% to about 8% by weight antimony;
- about 0.03% to about 4% by weight copper;
- about 0.03% to about 4% be weight nickel;
- about 66% to about 90% by weight indium;
- and
- about 0.5% to about 9% by weight silver.
A method of forming a solder composition comprising mixing indium, nickel, copper, zinc, silver, antimony, and tin together to form an alloy that includes:
- about 11% to about 17% by weight tin;
- about 0.5% to about 3% by weight antimony;
- about 0.5% to about 1.5% by weight copper;
- about 0.5% to about 5% by weight nickel;
- about 72% to about 77% by weight indium;
- about 4% to about 8.5% by weight silver;
- and
- about 0.3% to about 1.5% by weight zinc.
Dependencies are inferred from the claim text.