Substrate position aligner

A substrate position aligner comprising:

• a substrate holding assembly configured to hold a substrate in a vertical orientation, wherein the substrate holding assembly has a center of substrate rotation defined within the substrate holding assembly;
• at least three idler rollers and a drive roller, wherein each roller has a point on its perimeter spaced on a common radius from the center of substrate rotation;
• a rotation mechanism configured to rotate the drive rollers;
• a first sensor configured to detect the substrate when located in the substrate holding assembly;
• and
• a second sensor and third sensor each configured to detect a presence of an orientation cut in the substrate when the substrate is adjacent to or in a cut-down orientation.

A method of aligning a substrate having an orientation cut, the method comprising:

• placing the substrate on a plurality of rollers, wherein the rollers are distributed such that the substrate is supported on at least two rollers at all times;
• sensing a presence of the substrate on the rollers;
• and
• sensing a presence of the orientation cut when the orientation cut is not orientated within a range between about −44 degrees and about +44 degrees from horizontal.