Stackable photonic interconnect module

A system, comprising:

• a processor;
• memory;
• and
• an interconnect module, wherein the interconnect module includes:
• an electrical connector, at a first edge of the interconnect module, configured to receive and to provide electrical signals;
• an optical fiber, at a second edge of the interconnect module, configured to receive and to provide optical signals;
• a bridge chip, having a first surface and coupled to the electrical connector and the optical fiber, configured to convert the electrical signals into the optical signals and the optical signals into the electrical signals;
• and
• an integrated circuit, having a second surface facing the first surface, configured to transmit and to receive the electrical signals;
• and
• a backplane coupled to the interconnect module in conjunction with zero or more additional instances of the interconnect module in a stacked configuration.

A method for providing and receiving electrical signals and optical signals, wherein the method comprises:

• receiving and providing the electrical signals via an electrical connector at a first edge of an interconnect module;
• receiving and providing the optical signals via an optical fiber at a second edge of the interconnect module;
• converting the electrical signals into the optical signals and the optical signals into the electrical signals using a bridge chip in the interconnect module, wherein the bridge chip has a first surface;
• transmitting and receiving the electrical signals using an integrated circuit in the interconnect module, wherein the integrated circuit has a second surface facing the first surface;
• and
• communicating the electrical signals to and from the electrical connector to a backplane, wherein the interconnect module is coupled to the backplane in conjunction with zero or more additional instances of the interconnect module in a stacked configuration.