Photonic multi-chip module
AssigneeAPIC Corporation
InventorsBirendra Dutt, Ashok Kumar Kapoor
Life of this patent
Estimating the term…
Abstract
The subject matter disclosed herein relates to a photonic module comprising: a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on a silicon-on-insulator (SOI) wafer; electrical interface circuits to receive electrical signals from the CMOS IC chips and to modify the electrical signals; optical drivers to receive the modified electrical signals and to convert the modified electrical signals to optical signals; and a photonic layer on the SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit or receive the optical signals for communication among the CMOS IC chips.
Claims34
A photonic module comprising:
- a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on a silicon-on-insulator (SOI) wafer;
- electrical interface circuits to receive electrical signals from said CMOS IC chips and to modify said electrical signals;
- optical drivers to receive the modified electrical signals and to convert said modified electrical signals to optical signals;
- and
- a photonic layer on said SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit or receive said optical signals for communication among said CMOS IC chips.
A photonic module comprising:
- a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on an SOI wafer;
- interface chips comprising:
- an electrical interface circuit to modify electrical signals being communicated to or from said CMOS IC chips;
- and
- an optical I/O portion to convert the modified electrical signals to input optical signals or to convert output optical signals to output electrical signals;
- and
- a photonic layer on said SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit said output and input optical signals for communication among said CMOS IC chips.
A photonic module comprising:
- a silicon-on-insulator (SOI) wafer;
- one or more photonic components in a first layer on said SOI wafer;
- a plurality of CMOS integrated circuit (IC) chips flip-bonded on said SOI wafer;
- and
- an interface chip to modify voltages of signals received from individual ones of said plurality of CMOS IC chips and said one or more photonic components, wherein said interface chip is flip-bonded on said SOI wafer at a same level as said CMOS IC chips.
Dependencies are inferred from the claim text.