US 2014/0236528 A1 · MEASUREMENT METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE

Abstract

A measurement method for a junction-to-case thermal resistance is provided. First, a first transient cooling curve of the chip for the semiconductor device under test (DUT) without grease is measured. Then a second transient cooling curve of the chip for the DUT with grease is measured. A difference ΔT of temperature variations of the two transient cooling curves with and without grease is calculated. The temperature of a constant temperature cold plate for fixing the semiconductor DUT is increased by ΔT, and a third transient cooling curve of the chip for the DUT with grease is measured again. The first transient cooling curve and the third transient cooling curve are used to calculate the junction-to-case thermal resistance.

Claims9

Dependent claims

A measurement method for a junction-to-case thermal resistance, comprising:

measuring a first transient cooling curve of a chip for a semiconductor device under test (DUT) without grease;
measuring a second transient cooling curve of the chip for the semiconductor DUT with grease;
calculating a difference ΔT between a temperature variation of the first transient cooling curve and a temperature variation of the second transient cooling curve;
increasing a temperature of a constant temperature cold plate for fixing the semiconductor DUT by the difference ΔT, and measuring a third transient cooling curve of the chip for the semiconductor DUT with grease;
calculating the junction-to-case thermal resistance through using the first transient cooling curve and the third transient cooling curve.

2 more elements

Dependencies are inferred from the claim text.

Measurement method for junction-to-case thermal resistance

Life of this patent

Measurement method for junction-to-case thermal resistance

Life of this patent

Abstract

Claims9