Chemical mechanical polishing machine and polishing head assembly

A polishing head assembly comprising:

• a polishing head body including a groove;
• a membrane disposed in the groove and including a plurality of holes;
• and
• a fixing ring disposed between an external side surface of the membrane and an internal side surface of the groove,
• wherein a bottom surface of the membrane comprises a hydrophobic area and a hydrophilic area.

A chemical mechanical polishing machine, comprising:

• a turntable having a substantially flat top surface and configured to rotate horizontally;
• a polishing pad attached to and fixed on the top surface of the turntable;
• a polishing head assembly configured to move a wafer disposed on a bottom surface thereof into contact with the polishing pad and polish the wafer;
• a slurry supply device having at least one nozzle connected to an end portion thereof and configured to supply slurry on the polishing pad;
• and
• a conditioner having a diamond disk at an end portion thereof and configured to condition a surface of the polishing pad,
• wherein the polishing head assembly comprises:
• a shaft configured to rotate as a central axis for polishing the wafer;
• a polishing head body disposed at a bottom surface of the shaft, wherein the polishing head body includes a groove in a bottom surface thereof and a plurality of gas pipes passing through the polishing head body which are configured to be connected to the groove;
• a membrane disposed in the groove, wherein a bottom surface of the membrane comprises a hydrophobic area and a hydrophilic area;
• and
• a fixing ring having flexible properties and elastic properties and disposed between an external side surface of the membrane and an internal side surface of the groove in the polishing head body.