Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers

A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers in a double-side polishing device having an annular lower polishing plate covered with a first polishing pad, an annular upper polishing plate covered with a second polishing pad and a rolling device for carrier disks, the lower polishing plate, the upper polishing plate, and the rolling device being mounted rotatably about collinearly arranged axes, the method comprising:

• disposing at least one conditioning tool having external teeth and at least one spacer having external teeth in a working gap formed between the first and second polishing pad, the thickness of the at least one conditioning tool differing from the thickness of the at least one spacer;
• setting, simultaneously, the at least one conditioning tool and the least one spacer in revolving movement about the axis of the rolling device and in rotation themselves using the rolling device so as to generate material abrasion of at least one of the two polishing pads by the relative movement of the at least one conditioning tool.