Electronic interconnect devices having conductive vias

An electronic interconnect device comprising:

• a substrate having a first surface and a second surface, the substrate having a plurality of openings extending between the first and second surfaces, each opening having a conductive outer via, an insulative barrier and a conductive inner via, wherein the conductive outer via, insulative barrier and conductive inner via are concentric within the opening such that the insulative barrier is disposed between the conductive inner via and the conductive outer via, wherein the conductive inner via is configured to receive a conductor to be inserted therein;
• and
• a plurality of conductors received in corresponding conductive inner vias, the conductors being electrically connected to the conductive inner via, the conductors having a first end extending out of the openings and being configured to be electrically connected to a first electronic component.

An electronic interconnect system comprising:

• a substrate having a first surface and a second surface, the substrate having a plurality of openings extending between the first and second surfaces, each opening having a conductive outer via, an insulative barrier and a conductive inner via, wherein the conductive outer via, insulative barrier and conductive inner via are concentric within the opening such that the insulative barrier is disposed between the conductive inner via and the conductive outer via;
• and
• an electrical connector having a plurality of conductive compliant pins extending therefrom, the compliant pins comprising the conductors that provide electrical connections with the conductive inner vias, when the electrical connector is mated to the substrate at the first surface such that the compliant pins extend into corresponding openings to engage corresponding conductive inner vias.