Signal transmission cable
AssigneeSony Corporation
InventorsAkira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
Life of this patent
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Abstract
A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
Claims30
A signal transmission cable, comprising:
- a cable including a dielectric layer and a metallic layer;
- and
- a connector having a chip with a terminal, the connector including a substrate having an organic layer, a portion of the organic layer extending from the substrate so as to form the dielectric layer of the cable, the metallic layer being located on the dielectric layer and being directly connected to the terminal.
A connector for a signal transmission cable, the connector comprising:
- a chip including a terminal;
- and
- a substrate including an organic layer, a portion of the organic layer extending from the substrate so as to form a dielectric layer of a cable, a metallic layer being located on the dielectric layer and being directly connected to the terminal.
A substrate for a connector of a signal transmission cable, the substrate comprising:
- an organic layer, a portion of the organic layer extending from the substrate so as to form a dielectric layer of a cable;
- and
- a metallic layer located on the dielectric layer and being configured for direct connection to a terminal of a chip.
Dependencies are inferred from the claim text.