Thermal processing method and thermal processing apparatus for heating substrate, and susceptor

A thermal processing apparatus that heats a substrate of a circular plate shape by irradiating the substrate with a flash, the thermal processing apparatus comprising:

• an alignment mechanism that adjusts the position of a substrate;
• a susceptor on which a plurality of support pins is provided in upright position, the susceptor holding said substrate placed thereon while supporting a lower surface of said substrate with said support pins;
• a transport unit that transports said substrate from said alignment mechanism to said susceptor;
• and
• a flash lamp that heats said substrate placed on said susceptor by irradiating an upper surface of said substrate with a flash,
• wherein said alignment mechanism is configured to adjust the position of said substrate such that any of said support pins supports a radius connecting a portion of said substrate and the center of said substrate, the portion becoming the lowest position when said substrate warps in response to irradiation with a flash from said flash lamp such that the upper surface of said substrate becomes convex.

A susceptor on which a substrate of a circular plate shape is placed, the substrate being heated by being irradiated with a flash from a flash lamp, the susceptor comprising:

• a plate of a flat shape;
• and
• a plurality of support pins provided in upright position on an upper surface of said plate, the support pins supporting a lower surface of said substrate,
• wherein said support pins are arranged at positions where said support pins support a radius connecting a portion of said substrate and the center of said substrate, the portion becoming the lowest position when said substrate warps in response to irradiation with a flash such that an upper surface of said substrate becomes convex.