Substrate rapid thermal heating system and methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsNai-Han CHENG, Chi-Ming YANG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsNai-Han CHENG, Chi-Ming YANG
Estimating the term…
A method and apparatus for rapid thermal heat treatment of semiconductor and other substrates is provided. A number of heat lamps arranged in an array or other configuration produce light and heat radiation. The light and heat radiation is directed through a heat slot that forms a radiation beam of high intensity light and heat. The radiation beam is directed to a platen that includes multiple substrates. The apparatus and method include a controller that controls rotational and translational motion of the platen relative to the heat slot and also controls the power individually and collectively supplied to the heat lamps. A program is executed which maneuvers the platen such that all portions of all substrates receive the desired thermal treatment, i.e. attain a desired temperature for a desired time period.
A system for heat treating substrates, said system comprising:
A method for heat treating substrates, said method comprising:
A method for heat treating substrates, said method comprising:
Dependencies are inferred from the claim text.