Cover plate for wind mark control in spin coating process

A method for manufacturing semiconductor devices, the method comprising:

• positioning a substrate on a substrate holder, the substrate holder holding the substrate horizontally, the substrate holder having an axis of rotation, the substrate having a bottom surface that contacts the substrate holder, and a working surface opposite to the bottom surface;
• positioning a fluid-flow member above the substrate holder, the fluid-flow member having a substrate-facing surface, positioning the fluid-flow member includes positioning the substrate-facing surface vertically above the working surface at a predetermined average vertical distance above the working surface, at least a portion of the substrate-facing surface is curved such that a given vertical distance between the substrate-facing surface and the working surface varies radially relative to a given radial distance from the axis of rotation;
• dispensing a liquid material onto the working surface of the substrate via a liquid dispenser positioned above the substrate;
• and
• spinning the substrate and substrate holder via a rotation mechanism coupled to the substrate holder such that the liquid material spreads across the working surface of the substrate.

A spin coating apparatus for coating substrates, the spin coating apparatus comprising:

• a substrate holder configured to hold a substrate horizontally during a spin coating process;
• a rotation mechanism connected to the substrate holder, the rotation mechanism configured to rotate the substrate holder around an axis of rotation;
• a liquid dispenser configured to dispense a liquid material onto a working surface of the substrate when the substrate is disposed on the substrate holder, the working surface being planar and opposite to a bottom surface of the substrate that contacts the substrate holder;
• and
• a fluid-flow member having a substrate-facing surface, the fluid-flow member configured to be positioned such that the substrate-facing surface is positioned vertically above the working surface of the substrate when the substrate is disposed on the substrate holder, the fluid-flow member defining an approximately circular opening centered around the axis of rotation, the fluid-flow member configured such that a diameter of the defined opening can be increased and decreased.