Semiconductor Devices and Methods of Manufacture Thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Yi Yang, Ming Han Lee, Hsiang-Huan Lee, Hsien-Chang Wu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Yi Yang, Ming Han Lee, Hsiang-Huan Lee, Hsien-Chang Wu
Estimating the term…
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including a conductive feature formed in a first insulating material and a second insulating material disposed over the first insulating material. The second insulating material has an opening over the conductive feature. The method includes forming a graphene-based conductive layer over an exposed top surface of the conductive feature within the opening in the second conductive material, and forming a carbon-based adhesive layer over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is formed in the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.
A method of manufacturing a semiconductor device, the method comprising:
A method of manufacturing a semiconductor device, the method comprising:
15-20. (canceled)
A method of manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.