Semiconductor package and method of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsTae-Joo HWANG, Tae-Gyeong CHUNG, Eun-Chul AHN
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.
Claims11
1-18. (canceled)
A method of forming a semiconductor package, comprising:
- mounting a first semiconductor chip on a package substrate;
- disposing a first conductive terminal on an upper surface of the first semiconductor chip;
- preparing a chip package including a silicon substrate and through-hole vias in the silicon substrate, a second semiconductor chip on an upper surface of the silicon substrate, and a second conductive terminal on a lower surface of the silicon substrate;
- and
- mounting the chip package on the first semiconductor chip such that the first conductive terminal contacts the second conductive terminal.
Dependencies are inferred from the claim text.