Method for manufacturing a metal-insulator-semiconductor (mis) structure for an electroluminescent diode
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorIvan-Christophe Robin
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AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorIvan-Christophe Robin
Estimating the term…
A method for manufacturing a structure comprising a substrate made of at least one n-type semiconducting metal oxide is disclosed. In one aspect, the method comprises providing a substrate made of at least one n-type semiconducting metal oxide selected from the group consisting of: ZnO, CdO, MgO, ZnMgO, and ZnCdO, wherein the doping rate of which is less than or equal to 1018/cm3. The method further comprises depositing a layer which is 1 to 10 nm thick, made of an electrically insulating metal or metalloid oxide, having a dielectric constant which is at least equal to 4, on the first main surface of the substrate. The method further comprises annealing of the electrically insulating metal or metalloid oxide layer in an oxygen atmosphere. The method further comprises depositing at least one layer made of an electrically conductive material on the electrically insulating metal or metalloid oxide layer.
A method for manufacturing a structure comprising a substrate made of at least one n-type semiconducting metal oxide selected from the group consisting of ZnO, CdO, MgO, ZnMgO, and ZnCdO, wherein said substrate comprises a first main surface and a second main surface, wherein the first main surface of the substrate is covered with a layer made of an electrically insulating material, and the layer made of an electrically insulating material is covered with at least one layer made of an electrically conductive material, the method comprising:
Dependencies are inferred from the claim text.