Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae Yoon KIM, Seung Jae Lee, Ha Yeong Son, Jin Gi Hong, Seong Deok Hwang
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Abstract
A method of grinding a substrate is provided. A substrate including a first main surface having a semiconductor layer formed thereon and a second main surface opposed to the first main surface is prepared. A support film is attached to the first main surface using a glue. The second main surface of the substrate is ground so as to reduce a thickness of the substrate. The support film is removed from the first main surface by applying force to the support film in a non-traverse direction.
Claims20
A method of grinding a substrate, the method comprising:
- preparing a substrate including a first main surface having a semiconductor layer thereon and a second main surface opposed to the first main surface;
- attaching a support film to the first main surface using a glue;
- curing the glue by applying energy thereto;
- grinding the second main surface of the substrate so as to reduce a thickness of the substrate;
- and
- removing the support film from the first main surface by applying force to the support film in a non-traverse direction.
A method of manufacturing a semiconductor light emitting device, the method comprising:
- preparing a wafer including a first main surface on which an epitaxial layer for a semiconductor light emitting device is disposed and a second main surface opposed to the first main surface;
- attaching a support film to the first main surface using a glue;
- curing the glue by applying energy thereto;
- grinding the second main surface of the wafer so as to reduce a thickness of the wafer;
- removing the support film from the first main surface by applying force to the support film in a non-traverse direction;
- and
- cutting the wafer into individual light emitting devices.
A method of manufacturing light emitting devices, the method comprising:
- preparing a wafer comprising a substrate including a first main surface on which a semiconductor layer is disposed and a second main surface opposed to the first main surface;
- attaching a support film to the first main surface using a glue;
- grinding the second main surface of the wafer so as to reduce a thickness of the wafer;
- removing the support film from the first main surface by applying force to the support film in a non-transverse direction;
- and
- cutting the wafer into a plurality of light emitting devices.
Dependencies are inferred from the claim text.