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US 2014/0234995 A1Published application
Method of forming flexible and tunable semiconductor photonic circuits
OwnerMo Li, Yu Cheninventors
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Abstract
Methods to physically transfer highly integrated silicon photonic devices from high-quality, crystalline semiconductors on to flexible plastic substrates by a transfer-and-bond fabrication method. With this method, photonic circuits including interferometers and resonators can be transferred onto flexible plastic substrates with preserved optical functionalities and performance.
Claims18
A method of making a flexible semiconductor photonic circuit, the method comprising:
- forming a semiconductor photonic circuit on an insulator layer;
- removing a portion of the insulator from below the semiconductor photonic circuit while maintaining some insulator below the semiconductor photonic circuit;
- applying a flexible layer onto the undercut semiconductor photonic circuit to bond the flexible layer to the circuit;
- and
- separating the non-adhesive flexible layer with the semiconductor photonic circuit bonded thereon from the insulator layer.
2 more elements
A method of making a flexible semiconductor photonic circuit, the method comprising:
- forming a semiconductor photonic circuit on an insulator layer, the circuit having an exposed upper surface area and an interface area with the insulator layer;
- removing a portion of the insulator to reduce the interface area to be less than the upper surface area;
- bonding a flexible layer onto the upper surface area;
- and
- separating the flexible layer with the semiconductor photonic circuit bonded thereon from the insulator layer.
2 more elements
Dependencies are inferred from the claim text.