Developing solution and development processing method of photosensitive resin composition
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsHiroki Chisaka, Kunihiro Noda, Dai Shiota
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsHiroki Chisaka, Kunihiro Noda, Dai Shiota
Estimating the term…
A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.
A developing solution for a polyimide precursor, comprising:
Dependencies are inferred from the claim text.