Positive-type photosensitive resin composition, and insulating film and oled formed using the same
AssigneeKolon Industries, Inc.
InventorsSe Hyung Park, Byoung Kee Kim
Life of this patent
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Abstract
This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.
Claims16
A positive-type photosensitive resin composition, comprising an alkali soluble resin, a diazide-based photosensitive compound and a sensitivity enhancer, wherein the alkali soluble resin is a polyimide resin having a degree of imidization of 50˜75%.
Dependencies are inferred from the claim text.