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AssigneeRobert Bosch GmbH
InventorsThomas Kalich, Frank Wetzl, Bernd Hohenberger, Rainer Holz, Christiane Frueh, Andreas Fix, Michael Guyenot, Andrea Feiock, Martin Rittner, Michael Guenther
Estimating the term…
The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.
A layer composite (10), which comprises at least one support film (11) and a layer arrangement 12 applied thereto comprising at least one sinterable layer (13) which has been applied to the support film (11) and contains at least one metal powder and a solder layer (14) applied to the sinterable layer (13).
A process for forming a layer composite (10), which comprises the following steps:
Dependencies are inferred from the claim text.