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US 2014/0234033 A1Published application
Substrate conveyance apparatus and substrate peeling system
AssigneeTokyo Electron Limited
InventorsYasuharu IWASHITA, Osamu HIRAKAWA, Yasutaka SOMA, Takeshi TAMURA, Kazutaka NODA
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Abstract
Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.
Claims10
A substrate conveyance apparatus comprising:
- a plurality of nozzles configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner, and
- a main body unit provided with the plurality of nozzles,
- wherein at least surfaces of the plurality of nozzles are formed of a resin.
A substrate peeling system comprising:
- a peeling apparatus configured to separate a superimposed substrate including a first substrate bonded to a second substrate into the first substrate and the second substrate;
- and
- a substrate conveyance apparatus configured to convey the first substrate separated by the peeling apparatus while holding the first substrate in a non-contact manner,
- wherein the substrate conveyance apparatus includes a plurality of nozzles configured to jet a gas toward a surface of the first substrate to hold the first substrate in a non-contact manner, and
- a main body unit provided with the plurality of nozzles,
- wherein at least surfaces of the plurality of nozzles are formed of a resin.
3 more elements
Dependencies are inferred from the claim text.