Speaker assembly and electronic device using same
AssigneeChiun Mai Communication Systems, Inc.
InventorsCHI-SHENG TSENG, YI-HUNG KUO, CHING-MING HUNG, KUANG-HSIEN WANG
Life of this patent
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Abstract
A speaker assembly is configured for assembly to a housing. The housing defines a through hole and a receiving groove communicating with each other. The speaker assembly includes a speaker and a speaker cover. The speaker is received in the through hole. The speaker cover has an extending edge beyond a peripheral wall of the speaker and is received in the receiving groove.
Claims10
A speaker assembly configured for assembled to a housing, the housing defining a through hole and a receiving groove communicating with each other, comprising:
- a speaker;
- and
- a speaker cover, the speaker being received in the through hole, the speaker cover having an extending edge beyond a peripheral wall of the speaker and being received in the receiving groove.
An electronic device, comprising:
- a housing including a base plate, the base plate defining a through hole and a receiving groove communicating with each other, the receiving groove being larger than the through hole, thereby forming a supporting surface extending continuously around all sides of the through hole;
- and
- a speaker assembly including a speaker and a speaker cover, the speaker being received in the through hole, the speaker cover having an extending edge beyond a peripheral wall of the speaker and being received in the receiving groove.
Dependencies are inferred from the claim text.