Tape package and flat panel display device including the same
AssigneeSamsung Display Co., Ltd.
InventorHee-Jin Lee
Life of this patent
Estimating the term…
Abstract
Provided are a tape package and a flat panel display device including the tape package. The tape package includes a base film, a semiconductor chip mounted on one surface of the base film, a wire pattern including an input wire pattern and an output wire pattern formed on one surface of the base film and electrically connected with the semiconductor chip, a solder resist covering the remaining portion, except for an end of the wire pattern, and a protection film provided on an edge at one side of the solder resist facing an end of the output wire pattern.
Claims16
A tape package, comprising:
- a base film;
- a semiconductor chip mounted on one surface of the base film;
- a wire pattern including an input wire pattern and an output wire pattern formed on the one surface of the base film and electrically connected with the semiconductor chip;
- a solder resist covering the wire pattern and exposing an end of the wire pattern;
- and
- a protection film provided on an edge at one side of the solder resist facing an end of the output wire pattern.
A flat panel display device, comprising:
- a display panel including a first substrate and a second substrate;
- a printed circuit board configured to transmit a control signal to the display panel;
- and
- a tape package having one end bonded to the first substrate and the other end bonded to the printed circuit board, and bent toward an external surface of the second substrate so that the printed circuit board faces the second substrate, the tape package comprising a base film including a wire pattern, a semiconductor chip, and a solder resist on one surface facing an exterior of the tape package, and a protection film covering an edge at one side of the solder resist at a bent portion of the base film.
Dependencies are inferred from the claim text.