Method for manufacturing an integrated circuit and an integrated circuit

An integrated circuit, the integrated circuit comprising:

• an electronic circuit, which is arranged at least one of over and in a carrier;
• at least one metallization layer structure configured to electrically connect the electronic circuit;
• and
• a solid state electrolyte battery, which is at least partially formed in the at least one metallization layer structure, wherein the solid state electrolyte battery is electrically connected to the electronic circuit.

A method for manufacturing an integrated circuit, the method comprising:

• forming an electronic circuit at least one of over and in a carrier,
• forming a first part of a metallization structure at least one of over and in the electronic circuit, wherein the metallization structure is configured to at least electrically connect the electronic circuit;
• forming a solid state electrolyte battery over the first part of the metallization structure, the solid state electrolyte battery including at least a first electrode and a second electrode, wherein the first electrode of the solid state electrolyte battery is electrically connected to the electronic circuit via the first part of the metallization structure;
• and
• forming a second part of the metallization structure at least one of over and in the solid state electrolyte battery, wherein the second electrode of the solid state electrolyte battery is electrically connected with the electronic circuit via the second part of the metallization structure.