Back to results
US 2014/0233195 A1Published application
Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi IKUTA, Kazuhide DOI
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a semiconductor device includes a housing, a board in the housing, a semiconductor component on the board, a controller on the board, a first terminal, and a second terminal. The first terminal is exposed to an outside of the housing and electrically connected to the semiconductor component via the controller. The second terminal is on the board in the housing and is electrically connected to the semiconductor component.
Claims12
A semiconductor device comprising:
- a housing;
- a board in the housing;
- a memory card comprising first terminals, the memory card attached to the board with the first terminals facing opposite to the board;
- bonding wires connecting first terminals of the memory card and the board;
- a sealing portion covering the bonding wires;
- a controller chip on the board;
- a connector attached to the board, comprising second terminals electrically connected to the memory card via the controller chip, the connector exposed to an outside of the housing and connectable to an external apparatus;
- and
- third terminals arranged at an end of the board in the housing and electrically connected to the memory card without via the controller chip, and, with the housing removed, connectable to external test terminals.
6 more elements
A semiconductor device comprising:
- a housing;
- a board in the housing;
- a semiconductor memory component on the board;
- a controller chip on the board;
- a connector attached to the board, the connector comprising first terminals electrically connected to the semiconductor memory component via the controller chip, the connector exposed to an outside of the housing and connectable to an external apparatus;
- and
- second terminals arranged at an end of the board in the housing and electrically connected to the semiconductor memory component without via the controller chip, and, with the housing removed, connectable to external test terminals.
4 more elements
A semiconductor device comprising:
- a housing;
- a board in the housing;
- a semiconductor component on the board;
- a controller on the board;
- a first terminal exposed to an outside of the housing and electrically connected to the semiconductor component via the controller;
- and
- a second terminal on the board in the housing, the second terminal electrically connected to the semiconductor component.
4 more elements
Dependencies are inferred from the claim text.