US 2014/0233191 A1Published application

Module board

AssigneeFujitsu Component Limited

InventorsTatsuya Kakehashi, Masakazu Muranaga, Shinya Yamamoto

Life of this patent

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Abstract

A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

Claims8

Dependent claims

A module board, comprising:

a first board including a first surface and a second surface on each of which an electronic component is mounted;
a second board in which a first surface thereof faces the second surface of the first board;
an external electrode formed on an exterior of the second board;
and
a joining member that joins the external electrode and a terminal provided on the second surface of the first board,
wherein
the external electrode includes
a first surface part positioned on the first surface of the second board;
a second surface part positioned on a second surface of the second board opposite to the first surface thereof;
and
a connecting part connecting the first surface part and the second surface part, and
the joining member includes a joining surface that joins to the external electrode, and the joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/184,958Filed 20 Feb 2014
Priority: JP 2013-03245021 Feb 2013
Published: 21 Aug 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/144
Structural association of two or more printed circuits: stacked arrangements of planar printed circuit boards
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 1/141
Structural association of two or more printed circuits: one or more single auxiliary printed circuits mounted on a main printed circuit, e.g.…
H10W 90/401
Package configurations: characterised by multiple insulating or insulated package substrates, interposers or RDLs