Electronic module
AssigneeMurata Manufacturing Co., Ltd.
InventorShigeru TAGO
Life of this patent
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Abstract
An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted.
Claims14
An electronic module comprising:
- a substrate;
- at least one built-in electronic component that is built into an inside of the substrate;
- and
- a plurality of surface mount electronic components that are mounted on a front surface of the substrate;
- wherein
- a suckable region, which is a region that can be sucked by a nozzle of a vacuum suction apparatus and within which none of the surface mount electronic components are mounted, is provided on the front surface of the substrate;
- when viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is located inside of a region in which one of the at least one built-in electronic components is built in and a center of gravity of the electronic module is located inside of the suckable region;
- and
- a protective layer is not provided on the front surface of the substrate on which the surface mount components are mounted.
Dependencies are inferred from the claim text.