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US 2014/0233188 A1Published application
Mounting structure for printed circuit board, and semiconductor device using such structure
AssigneeFuji Electric Co., Ltd.
InventorsNoriho Terasawa, Yasuyuki Momose
Life of this patent
Estimating the term…
Abstract
A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.
Claims11
A mounting structure for a printed circuit board, comprising:
- a printed circuit board to which a heavy material is fixed;
- a fixing member fixed to the printed circuit board immediately below the heavy material;
- and
- a receiving member fixed to a main body,
- wherein a bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.
2 more elements
A semiconductor device, comprising:
- a heat dissipation base;
- an insulating substrate with a conductive-pattern, fixed onto the heat dissipation base;
- a semiconductor chip fixed to the insulating substrate with the conductive-pattern;
- an electric conductor connecting the semiconductor chip and an external lead terminal;
- a resin case fixed to the heat dissipation base, and storing the insulating substrate with the conductive-pattern, fixed with the semiconductor chip;
- a lid fixed to the resin case;
- a receiving member fixed onto the lid;
- a fixing member having a bottom portion fixed to the receiving member by a resin adhesive;
- a printed circuit board to which an upper portion of the fixing member is fixed;
- and
- a screw member for fixing each of corners of the printed circuit board to the resin case,
- wherein the printed circuit board, the fixing member, the receiving member, and the resin adhesive configure a mounting structure for the printed circuit board.
9 more elements
A semiconductor device, comprising:
- a heat dissipation base;
- an insulating substrate with a conductive-pattern, fixed onto the heat dissipation base;
- a semiconductor chip fixed to the insulating substrate with the conductive-pattern;
- an electric conductor connecting the semiconductor chip and an external lead terminal;
- a receiving member fixed onto the insulating substrate with the conductive-pattern;
- a fixing member having a bottom portion fixed to the receiving member by a resin adhesive;
- a printed circuit board to which an upper portion of the fixing member is fixed;
- a screw member for fixing each of corners of the printed circuit board to the insulating substrate with the conductive-pattern;
- a resin case fixed to the heat dissipation base, and storing the insulating substrate with the conductive-pattern fixed with the semiconductor chip, the receiving member, the fixing member, and the printed circuit board;
- and
- a lid fixed to the resin case,
- wherein the printed circuit board, the fixing member, the receiving member, and the resin adhesive configure a mounting structure for the printed circuit board.
9 more elements
Dependencies are inferred from the claim text.